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Wet Resin Bond Diamond Trimming Wheel eliminates avalanche edge chipping during high-speed porcelain tile processing with 0.5mm deep grinding capacity. Achieves ≤0.2% edge fracture rate and daily output of 28,000 sqm for low-absorption tiles. Custom diameters available , wholesale discounts apply.
Order(MOQ) :
30 pcsColor :
RegularShipping Port :
Xiamen PortLead Time :
7-20 days after paymentCustomized support :
Visualization ServiceBrand Name :
OEMWet Resin Bonded Diamond Trimming Wheel-0.5mm Deep Grinding For Ceramic Tile
Product Description:
Premium wet resin bond diamond trimming wheel designed for precision edge processing of porcelain tiles. Eliminates avalanche edge defects while maintaining ≤0.2% chipping rate, with 0.5mm controlled grinding depth for clean cuts.
Product Parameters:
Product Highlights:
Company Service Advantages:
We are committed to providing high-quality products that meet industry standards.
Q: Suitable for all porcelain tiles?
A: Optimized for polished/glazed tiles (water absorption <0.5%)
Q: Metal vs resin bond for tile grinding?
A: Metal bond excels in wet grinding with 3x longer life and better heat dissipation.
Q: How to identify wear?
A: Monitor current load - >15% increase indicates dressing needed.
Q: How to determine when the grinding wheel needs replacement?
A: Replacement is required when the following occur:
① Daily output decreases by >15% (compared to the baseline 13,000 sqm)
② Tile edge chipping rate exceeds 0.3%
③ Grinding noise exceeds 85 dB
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